Epoxy underfill chip level adhesives
@eucleveladhesives
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About
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA a
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Huizhou City, Guangdong，China
Member since December 04, 2022